ÄPRE’s Spectrally Controlled Interferometry was awarded one of Laser Focus World’s highest awards
for innovation in photonics, a Gold-Level Honoree. We are proud to be recognized by this leading industry journal for the innovation that SCI brings to optical testing.
Substrates for filters, wafers, windows, waveplates, etc., have strict tolerances on surface form and mid-spatial frequencies. SCI requires no surface preparation, aligns quickly like a laser interferometer, and measures front and back surfaces in one setup. Learn More
Measure TTV down to 100 µm thin substrates. There is not other direct measurement technique on thin parts and measurements take <1 second. Learn More
Prisms typically are measured on multiple instruments and separate setups. SCI measures four critical parameters in one setup with no preparation.
Prism stacks, like RGB combiner prisms, are easily measured with SCI. Moving the fringe position through the prism stack channels isolates each measurement.
The front and back dome spheres create confused fringes in a laser interferometer. SCI, using a standard Transmission Sphere (TS), easily aligns the dome in “laser” mode, and then measures front, back, thickness variation and centration in one set up.
SCI eliminates back reflections through the blocked flats that frustrate surface measurements with standard laser Fizeau interferometers. THEN, without moving the part, electronically move the SCI fringes to the block “reference” to measure the wedge of each part individually.
Measure easy to prepare plane parallel polished parts for homogeneity, WITHOUT moving the part. SCI separates the measurement cavities required for accurate homogeneity measurement: Front, Back, Cavity and Material. SCI, combined with REVEAL’s homogeneity application, does it for you.
“SCI from Äpre Instruments is a breakthrough technology that allows Sydor Optics to measure substrates more efficiently than with conventional interferometry. SCI enables the accurate measurement of flat and ultra-parallel surfaces without the interference of background fringes that are common for standard interferometric systems”
You don’t have time to hunt for fringes. Getting the part aligned, measured and out the door is key to efficient manufacture.
Isolating fringes on your surface is easy with SCI. You move the fringes to your surface and simply measure. There is almost no limitation to how thin your part can be. Plus there is no long wait while a laser scans and software hopefully pulls out your surface.
Total Thickness Variation on 100 µm thin parts? No problem! And in one measurement for increased accuracy and speed.
